Product description:
Amaoe EMMC2 BGA Reballing Stencil Template per disco rigido Android EMMC EMCP UFS Tin Planting Saldatura Netto 0.15MM
Amaoe EMMC2 BGA Reballing Stencil Template per disco rigido Android EMMC EMCP UFS Tin Planting Saldatura Netto 0.15MM
4.89EUR
Product web site:
aliexpress.com (IT)